Samsung might finally have a fix for one of the biggest complaints about its Exynos chips: overheating and poor power efficiency. 
A new report out of South Korea suggests that the upcoming Exynos 2600 chip will introduce next-gen thermal management features to tackle these longstanding issues.
The Exynos 2600, expected to appear in select Galaxy S26 models, is reportedly being developed using advanced packaging technologies. One major innovation is the implementation of Heat Pass Block (HPB), a copper-based heat sink integrated into the chip package to absorb and dissipate heat generated by the CPU, GPU, and RAM. This is the first time Samsung has used HPB in any of its chips.
HPB isn’t the only advancement. The chip will also utilize Fan-Out Wafer Level Packaging (FOWLP), a method that positions input/output terminals outside the chip’s core structure, enhancing thermal performance and reducing power loss. These design choices indicate a serious effort by Samsung to bring Exynos chips closer to the performance and efficiency standards set by Qualcomm’s Snapdragon processors.
Built on Samsung Foundry’s 2nm process, the Exynos 2600 is expected to complete testing by October. If all goes well, mass production could begin soon after, in time for the early 2026 launch of the Galaxy S26 lineup. However, the Galaxy S26 Ultra may still rely solely on Qualcomm’s Snapdragon 8 Elite Gen 2, reserving the Exynos 2600 for other variants.
Samsung has struggled in recent years with making its Exynos chips competitive, but these latest innovations could finally turn the tide. With better heat control and power efficiency, the Exynos 2600 might just be the company’s comeback moment in mobile silicon.