Honor has officially confirmed the launch date for its highly anticipated Magic V5 foldable phone. The device will be unveiled at a special launch event scheduled for July 2 in Shenzhen, China. 
The event will start at 7 PM local time (2 PM UTC) and will showcase a variety of new Honor devices.
The Magic V5 is expected to offer significant upgrades over its predecessor, the Magic V3. These include a powerful 6,100mAh battery capable of 66W fast charging, a 200MP periscope telephoto camera, and the cutting-edge Snapdragon 8 Elite Leading Version chip. One of the most exciting features is the device’s ultra-slim design, which is rumored to be under 9mm thick, making it the thinnest foldable to date. If confirmed, this would dethrone the Oppo Find N5, which has a thickness of 8.9mm.
Additionally, the Magic V5 is expected to come with an 8-inch main display and a 6.45-inch cover screen, offering a more expansive and immersive user experience. With these enhancements, the Magic V5 looks set to push the boundaries of foldable phone design, with a blend of powerful hardware and sleek aesthetics.
2 comments