Huawei is still navigating the hurdles of producing advanced chips in-house, as its latest Kirin X90 SoC is built using SMIC’s older 7nm process rather than the more efficient 5nm node.
Despite speculation, recent analyses from TechInsights confirm that the Kirin X90, featured in the MateBook Fold, is manufactured on the 7nm (N+2) process, not the rumored 5nm (N+3).
Why the hold-up? The root issue lies in the export restrictions placed on Huawei and SMIC, limiting access to cutting-edge EUV (Extreme Ultraviolet) lithography machines. These machines are crucial for producing chips smaller than 7nm, but without valid export licenses, China’s chipmakers are stuck using older DUV (Deep Ultraviolet) equipment. This technological bottleneck makes it nearly impossible to mass-produce competitive 5nm chipsets.
Huawei has tried to adapt by investing in local tools and innovation, reportedly developing 14nm EDA (Electronic Design Automation) tools to enable 7nm production. While this is an impressive workaround, it still lags far behind the 2nm technologies that companies like Apple, AMD, Qualcomm, Intel, and TSMC are expected to commercialize within the next two years. In fact, Huawei’s reliance on a 7nm equivalent process places it approximately three generations behind its global rivals.
Though rumors suggest Huawei is preparing to commercialize 5nm chips, no official release is expected this year. Until China gains access to next-gen semiconductor tools, the country’s chip technology will likely remain several steps behind the global curve.