The iPhone 18 Pro is set to push the boundaries of smartphone performance with some revolutionary chip technology. Expected to launch next year, it’s rumored to feature TSMC’s cutting-edge 2nm fabrication process for its SoC (System on Chip). This new process will be paired with an advanced packaging method that could significantly enhance performance.
Sources indicate that TSMC is preparing a dedicated production line to cater specifically to Apple, with mass production slated for 2026.
In terms of the actual chip, the A20 chip in the iPhone 18 series is believed to switch from the current InFO (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging. So, what’s the difference? InFO packaging integrates multiple components, including memory, within a single package, which allows for thinner devices and faster, more energy-efficient chips. On the other hand, WMCM packaging allows Apple to integrate several chips, such as custom accelerators, CPUs, GPUs, and DRAM, into one compact unit, offering greater flexibility and significantly enhanced performance for demanding tasks.
Notably, WMCM offers better chip communication and data-sharing capabilities, improving overall system efficiency. Apple is reportedly set to be the first to receive 2nm chips, with TSMC starting production in late 2025 at their Chiayi P1 fab. The monthly production capacity for WMCM packaging is expected to reach 10,000 units by 2026, which will help meet the demand for Apple’s most powerful devices.
The iPhone 18 Pro will be the sole model to feature this innovative A20 2nm chip. Analyst Ming-Chi Kuo has also predicted that only the Pro models will come with a massive 12GB of RAM, thanks to the new packaging method. To give you an idea of what this means, the 2nm process will shrink transistor sizes, allowing more transistors to fit on a chip. This leads to faster processing speeds and lower energy consumption, a huge leap forward in mobile tech.
For comparison, last year’s iPhone 16 used the A18 chip built on the second-generation 3nm process called N3E. This year’s iPhone 17 is likely to feature the A19 chip, built on the N3P process, a more advanced version that increases performance and efficiency. So, Apple’s shift to 2nm and WMCM packaging isn’t just a minor upgrade; it’s a game-changer for mobile performance.
If you’re a fan of mobile tech, these advancements make the iPhone 18 Pro an exciting prospect for next year. The future of smartphones is looking faster, smarter, and more power-efficient than ever.