The Pixel 10 series, along with Google’s upcoming Tensor G5 chipset, is set to launch later this year. For the first time, Google is shifting its mass production of the high-end chip from Samsung to TSMC. This decision follows challenges faced by Samsung in improving yields with its 3nm GAA technology, prompting Google to seek a more reliable alternative.
However, a leaked image has revealed that Samsung was involved in at least the early prototyping phase of the Tensor G5 SoC.
An anonymous tipster shared an image with @Jukanlosreve showing the Tensor G5 prototype from the Pixel 10. The ‘SEC’ marking indicates that this particular silicon came from Samsung, not TSMC, while the ‘G5’ label confirms that it’s the upcoming chip for Google’s flagship phones. Interestingly, another label, ‘K3KL4L4,’ might actually refer to the DRAM instead of the chip itself, so further clarification is needed.
It’s been previously reported that Samsung had been heavily analyzing Google’s decision to opt for TSMC’s 3nm process instead of their 3nm GAA tech. Talks between the two companies suggested Samsung was at least in the running for mass production. But Google recently struck a long-term deal with TSMC, possibly spanning five years, to exclusively manufacture the Pixel 14’s silicon. The Tensor G5 will be produced using TSMC’s advanced second-generation 3nm process, with the Tensor G6 likely moving to the 2nm node in the future to compete with other chipmakers.
While Samsung may have lost out on Google’s chip orders, the company is not giving up. Samsung is working to improve its 2nm GAA technology and is targeting a 70% yield rate within six months. This progress could help it regain ground in the mass production market. However, Google hasn’t completely severed ties with Samsung, as the Pixel 10 will feature Samsung’s Exynos 5G modems. If Samsung’s lithography advancements continue, there may be room for future collaboration on chip production.
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