Samsung is stepping up its game in the semiconductor race, aiming to turn its 2nm GAA (Gate-All-Around) process into a real alternative to TSMC’s dominant solutions. While the Taiwanese giant currently leads the pack with its more mature 2nm technology, Samsung has chosen a more calculated route-delaying its 1.4nm process to focus entirely on refining and optimizing 2nm production.
The Korean tech giant’s strategy, dubbed ‘selection and concentration,’ is centered on improving yields, minimizing production costs, and resolving performance and heat dissipation issues.
Though Samsung’s yields still trail TSMC by 20–30%, the latest internal forecasts are surprisingly more optimistic than previously expected. The company is reportedly aiming for a 70% yield rate-an ambitious but necessary target if it hopes to attract clients away from TSMC.
Manufacturing lines are already being prepped at Samsung’s Pyeongtaek site, with mass production targeted for the second half of 2025. Internally, the company expects demand for 2nm GAA wafers to remain strong for at least three to four years. That long tail of demand gives Samsung a valuable window to refine its tech and build trust in a market that has long favored its rival.
In parallel, Samsung is preparing a roadmap of enhanced 2nm nodes. A second-generation version is already designed, and a third-gen variant-nicknamed ‘SF2P+’-is expected within two years. Whether these newer iterations will roll out at existing facilities or newly constructed plants remains unconfirmed.
Still, industry skepticism remains. Samsung’s mixed history in advanced chip manufacturing means that many clients may wait to see proven performance before placing orders. Competitive pricing and consistent delivery will be crucial for Samsung to truly challenge TSMC’s dominance.