Excitement is building for the upcoming release of the Samsung Galaxy Z Flip 7 and Galaxy Z Fold 7, which will be unveiled next month during Samsung’s Galaxy Unpacked event in New York City.
The event is expected to take place between early and mid-July, according to sources from Korea.
The Galaxy Z Fold 7 has generated a lot of buzz as all leaks suggest that it will be a bigger, slimmer, and overall improved version compared to the Galaxy Z Fold 6. In fact, an industry insider has even hinted that the Fold 7 will introduce some industry-first technologies, showing that Samsung is serious about advancing its foldable phone lineup.
Additionally, the report from Korea reveals that the domestic version of the Flip 7 will feature Samsung’s Exynos 2500 chipset, which has been in development for quite some time. Initially planned for the Samsung Galaxy S25 series, this chipset faced delays due to manufacturing issues. However, other markets will likely receive the Galaxy Z Flip 7 with a different chipset. On the other hand, the Galaxy Z Fold 7 is set to feature the Snapdragon 8 Elite chipset worldwide, providing enhanced performance across all regions.
Fans of Samsung’s foldables will also be thrilled by the rumors of the Galaxy Z Flip 7 FE, a more affordable variant of the Flip 7. This rumored model, if confirmed, will allow more consumers to experience foldable technology at a lower price point.
But that’s not all-Samsung is reportedly working on a tri-foldable smartphone, which could be released later this year. However, the device will likely have a limited release in select regions. The buzz around foldable phones isn’t limited to Samsung, as rumors of a foldable iPhone from Apple are starting to heat up, with many expecting its arrival next year.
In a recent teaser, Samsung promised the Galaxy Z Fold 7 would offer an “Ultra” experience, though reports about its battery life and charging speeds have been underwhelming. Still, tech enthusiasts are holding out hope that the Fold 7 will deliver on the industry-first technologies rumored to be included.
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