Qualcomm appears to be blurring the lines between flagship and mid-range chipsets with its upcoming Snapdragon 8s Gen 5, rumored to carry the model number SM8845.
Slated to debut by the end of 2025, this chip could pack near-flagship performance thanks to cutting-edge manufacturing and advanced architecture.
According to prominent leaker Digital Chat Station, the Snapdragon 8s Gen 5 will be built on TSMC’s third-generation 3nm N3P process, promising better efficiency and thermal performance compared to its predecessors
. Notably, the SoC will also incorporate Qualcomm’s custom Oryon cores, previously reserved for its high-end Elite series, suggesting a major performance uplift.
Qualcomm may be taking a page out of Apple’s playbook by binning its silicon – essentially using slightly scaled-down versions of elite chipsets in more affordable segments. This strategy could make the 8s Gen 5 a cost-effective yet powerful option for smartphone makers who want flagship-level capabilities without flagship prices.
The rumor mill hints that the 8s Gen 5 will share several IPs and GPU features with the Snapdragon 8 Elite Gen 2, narrowing the performance gap significantly. If true, consumers could see devices powered by this chip opening apps faster, handling games smoother, and consuming less battery – all without the elite price tag.
While some argue the naming scheme might be misleading – with some insiders believing the SM8845 is more likely to be the Snapdragon 8 Plus Gen 5 – the consistent theme is that Qualcomm is preparing a powerful, efficient chip that bridges the performance divide between tiers.
We’ll have to wait for the official unveiling at the Snapdragon Summit this September to see how much of this pans out, but if the leaks hold, the Snapdragon 8s Gen 5 might just become the new sweet spot in mobile performance.