TSMC, the world’s top contract chipmaker and a key supplier to NVIDIA and Apple, is reportedly planning a massive ramp-up of its 2-nanometer (2nm) chip production. 
Sources from Taiwan’s supply chain reveal that TSMC may boost monthly output to a staggering 200,000 wafers by the end of 2027, marking a fivefold increase from its expected 40,000 wafers per month target by late 2025.
The surge in production is being driven by insatiable demand from tech giants including Apple, NVIDIA, Intel, AMD, and MediaTek. Mass production of 2nm chips is set to begin this year, with a significant scale-up already penciled in for 2026-TSMC aims to reach 100,000 wafers monthly by the end of that year. If demand holds strong, the company could double that again by 2027.
Apple is usually first in line for TSMC’s latest chips, leveraging them in its consumer devices, while companies like AMD and NVIDIA follow once manufacturing processes are refined for performance-heavy applications.
Achieving the 200,000 wafers milestone would make TSMC’s 2nm process its largest-ever sub-7nm operation. Most of the manufacturing is expected to take place at the firm’s state-of-the-art F22 plant in Kaohsiung, Taiwan, supported by seven additional fabs.
TSMC remains unmatched in producing 2nm chips at high yields for external clients. Though Samsung is developing similar technology, it has struggled with yield issues, allowing TSMC to dominate the advanced semiconductor manufacturing space.